Adhesive Bonding Technology
Araldite® 2015-1 is a two component, room temperature curing paste adhesive giving a resilient bond.
It is thixotropic and non-sagging up to 10 mm thickness. It is particularly suitable for SMC and GRP bonding.
- Toughened paste
- Ideal for bonding GRP, SMC and dissimilar substrates
- Gap filling, non-sagging up to 10mm thickness
- Good resistance to weathering