Polytec EP 630 - Unfilled Epoxy Adhesive
Adhesive Bonding Technology
Polytec EP 630 is a 100% solid, two-component, low viscosity, high temperature adhesive underfill and encapsulation. It provides excellent high temperature, chemical, electrical and moisture resistance.
Polytec EP 630 was designed for semiconductor, medical, hybrid, piezo, fiberoptics, HV and UHV applications. It has an excellent adhesion to silicon, glass, metal, ceramic, ferrite and most plastics and can be used as low viscosity adhesive, epoxy impregnation, underfill and encapsulation.
More over the Polytec EP 630 complies to USP Class VI Biocompatibility Standards. The material can be applied via dispensing, jet-dispensing and manual application.
The POLYTEC PT GmbH develops, manufactures and sells special adhesives for applications in the electronics, electrical engineering, medical technology and optics.