Polytec EP 630 - Unfilled Epoxy Adhesive

Adhesive Bonding Technology

Polytec EP 630 is a 100% solid, two-component, low viscosity, high temperature adhesive underfill and encapsulation. It provides excellent high temperature, chemical, electrical and moisture resistance.

Polytec EP 630 was designed for semiconductor, medical, hybrid, piezo, fiberoptics, HV and UHV applications. It has an excellent adhesion to silicon, glass, metal, ceramic, ferrite and most plastics and can be used as low viscosity adhesive, epoxy impregnation, underfill and encapsulation.

More over the Polytec EP 630 complies to USP Class VI Biocompatibility Standards. The material can be applied via dispensing, jet-dispensing and manual application.

Product Info
Polytec PT GmbH
Adhesive Bonding Technology

The POLYTEC PT GmbH develops, manufactures and sells special adhesives for applications in the electronics, electrical engineering, medical technology and optics.

Features

Size of application area
µm²-/µm³ range - micro parts
mm²-/mm³range - precision parts
cm²-/cm³ range - workpieces
System solutions
Adhesive
High Performance Plastics
PSU
PES
Thermoplastics
ABS
PA
PBT
PET
POM
PPE
PS
SB
Thermosetting Plastics
EP
Composites
CRP
FR4
GRP
Metals
aluminium
gold
cast iron
copper
brass
silicium
steel - chromated
steel - stainless
steel - galvanised
steel (blasted SA 2,5)
tin
Glass & Ceramic Materials
glass
ceramics
Components
2-part systems
2-part systems
2-part epoxy resins
Curing mechanisms
warm-/hot curing
Pot life @ +20/23°C - Minimum / hours
> 12 h
(Mixed) viscosity
medium viscosity
Packaging unit
small packaging unit (can, tube, etc.)
customized packaging
Temperature resistance <0°C (approx.)
from -55°C
Temperature resistance >0°C (approx.)
to +220°C
Shore-D
Sh-D 81 to 100
Colour and colour fastness
colour spectrum bright
Deformation capability
≤ 10%
biocompatibility
USP class VI/ISO 10993
Application Types
dot application
line, bead application
Mobility - Land Transportation / filter and fluid technology & hvac
thread sealings
Microtechnology / chipbonden
underfiller
Microtechnology / encapsulation
dam & fill
coatings
pottings
White Goods & Consumer Electronics / smart cards
RFID (radio frequency identification)
Medical & Biotechnology / medical equipment & accessories
several bondings - medical equipments
Medical & Biotechnology / medical applications
several bondings - medical applications

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