Polytec TC 411 - Thermally Conductive Adhesive

Adhesive Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

Polytec TC 411 has a great thermal conductivity and an excellent adhesion to ceramic, glass, semiconductor materials, metals and most plastics. The application can be performed directly from the side-by-side cartridge with a static mixing nozzle, using a dispensing gun.

Product Info
Polytec PT GmbH
Adhesive Bonding Technology

The POLYTEC PT GmbH develops, manufactures and sells special adhesives for applications in the electronics, electrical engineering, medical technology and optics.

Features

Size of application area
µm²-/µm³ range - micro parts
mm²-/mm³range - precision parts
cm²-/cm³ range - workpieces
System solutions
Adhesive
High Performance Plastics
PSU
PES
Thermoplastics
ABS
ASA
EPS
PA
PA (PA 6)
PA (PA 6.6)
PA (PA 12)
PBT
PC
PE-HD (High Density)
PE-LD (Low Density)
PET
POM
PP
PPE
PS
PUR (lower degree of cross-linking)
PVC (softer perfomance)
SAN
SB
XPS (rigid foam)
Thermosetting Plastics
EP
HPL
MF
PF
PUR (higher degree of cross-linking)
UP
Composites
CRP
BMC
FR4
GRP
SMC
Elastomers
CR
EPM/EPDM
NBR
NR
SBR
Metals
aluminium
plumb
bronze
chromium
gold
cast iron
copper
magnesium
brass
nickel
platinum
silver
silicium
steel - chromated
steel - stainless
steel - galvanised
steel (blasted SA 2,5)
titanium
zinc (also galvanized materials)
tin
Glass & Ceramic Materials
emaille
glass
ceramics
ceramic (techno-)
mosaic & tiles
Components
2-part systems
2-part systems
2-part epoxy resins
Curing mechanisms
room temperature curing
Pot life @ +20/23°C - Minimum / hours
1-2 h
(Mixed) viscosity
pasty
Packaging unit
cartridge (1- or 2-part)
customized packaging
Temperature resistance <0°C (approx.)
from -55°C
Temperature resistance >0°C (approx.)
to +120°C
Conductivity
electrically conductive
Shore-D
Sh-D 21 to 40
Colour and colour fastness
colour spectrum bright
white
Deformation capability
≤ 30%
Application Types
dot application
line, bead application
White Goods & Consumer Electronics / microelectronics / optics / sensor systems
sensor bondings

Contact Form

The search results from SUBSTRATEC are not sales recommendations and/or professional technical advice. It is only intended to make it easier for the user to pre-select suitable system that may be available. SUBSTRATEC gives no guarantee that the system suggested is successful or suitable for the specific area of application of the user. In the event of any questions regarding the use and suitability for the specific application, the user has the possibility to directly contact the respective technical contact person of the relevant manufacturer or supplier. See for further information Terms of Use.