AKEPOX® 5030

Bonding Technology
>AKEMI® chemisch technische Spezialfabrik GmbH AKEMI® chemisch technische Spezialfabrik GmbH
Bonding Technology

Your leading partner for stone and auto-chemistry since 1933.

Features

Size of application area
mm²/³range
cm²/³ range
Thermoplastics (Styrenes)
EPS
Thermosetting Plastics
EP
HPL
MF
PF
PUR (higher degree of cross-linking)
UP
Thermosets (Composites)
FR4
GRP
Metals - susceptible to corrosion (active)
bronze
cast iron
copper
brass
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
steel - stainless
steel - galvanised
Glass & Ceramic Materials
emaille
glass
ceramics
mosaic & tiles
porcelain
Construction Materials & Substrates
infrastructure - concrete & rock
artificial stones
natrual stones
subfloor - concrete/screed/cement
Wood & Timber
HPL laminate
cork
solid timber - primed, painted, coated
solid timber - untreated
MDF - medium density fiberboard
multiplex board
OSB - oriented strand board
2-part systems
epoxy resins
Solvents
solvent-free
Package labelling
hazardous labels
Sector classification
construction & craft
Temperature resistance >0°C (approx.)
to +100°C
Shore-D
Sh-D 81 to 100
Electrical conductivity
electrically insulating
Colour of adhesive film
colour spectrum bright
Mobility - Land Transportation
vehicle exteriors
vehicle interiors
Pot life @ +20/23°C - Minimum / minutes
31-59 min
Liquid Adhesives
2-part systems

Contact Form

The search results from SUBSTRATEC are not sales recommendations and/or professional technical advice. It is only intended to make it easier for the user to pre-select suitable adhesives that may be available. SUBSTRATEC gives no guarantee that the adhesive suggested is successful or suitable for the specific area of application of the user. In the event of any questions regarding the use and suitability for the specific application, the user has the possibility to directly contact the respective technical contact person of the relevant adhesive manufacturer or supplier. See for further information Terms of Use.