EPOXONIC® 195

Bonding Technology

Dual-cure adhesive for Microelectronics and Optoelectronics/Optics.

EPOXONIC® 195 is especially suited for quick fixation and bonding of devices and joining of various substrates like metals, plastics and glass.

Product Info

Features

Size of application area
µm²/³ range
mm²/³range
cm²/³ range
Thermoplastics
PA
PBT
PC
PET
Thermosetting Plastics
EP
HPL
Thermosets (Composites)
FR4
Metals - susceptible to corrosion (active)
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
Glass & Ceramic Materials
glass
1-part systems
epoxy resins
Solvents
solvent-free
Sector classification
manufacuting industry
Temperature resistance <0°C (approx.)
from -40°C
Temperature resistance >0°C (approx.)
to +150°C
Shore-D
Sh-D 81 to 100
Colour of adhesive film
colourless
colour spectrum bright
yellow
Curing mechanisms
warm-/hot curing
UV-/ light curing
Pot life @ +20/23°C - Minimum / seconds
11-30 sec
Pot life @ +20/23°C - Minimum / hours
1-2 h
(Mixed) viscosity
medium viscosity
Packaging unit
cartridge (1- or 2-part)
customized packaging
Liquid Adhesives
1-part systems

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