EPOXONIC® 276

Bonding Technology

Thermal conductive adhesive for Automotive Engineering, Microelectronics and Electrical Engineering.

EPOXONIC® 276 is especially suited for highstrength bonding of devices with need of thermal management (e.g. power semiconductors).

Product Info

Features

Size of application area
µm²/³ range
mm²/³range
cm²/³ range
Thermoplastics
PA (PA 6.6)
PBT
PC
PET
Thermosetting Plastics
EP
HPL
Thermosets (Composites)
CRP
BMC
FR4
GRP
SMC
Elastomers
EPM/EPDM
Metals - susceptible to corrosion (active)
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
magnets
steel - stainless steel
Glass & Ceramic Materials
glass
ceramic (techno-)
1-part systems
epoxy resins
Solvents
solvent-free
Sector classification
manufacuting industry
Temperature resistance <0°C (approx.)
from -40°C
Temperature resistance >0°C (approx.)
to +150°C
Thermal conductivity
heat-conductive
Colour of adhesive film
colour spectrum bright
Curing mechanisms
warm-/hot curing
Pot life @ +20/23°C - Minimum / hours
3-4 h
(Mixed) viscosity
pasty
Packaging unit
cartridge (1- or 2-part)
hobbock/ drum
customized packaging
Liquid Adhesives
1-part systems

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