EPOXONIC® 347

Bonding Technology

Flexible potting compound/adhesive with high thermal conductivity.

EPOXONIC® 347 is especially suited for metal to plastic bonding with high demand for temperature cycle stability.

Product Info

Features

Thermoplastics
PA (PA 6.6)
PBT
Thermosetting Plastics
EP
HPL
Thermosets (Composites)
CRP
BMC
FR4
GRP
SMC
Elastomers
EPM/EPDM
Metals - susceptible to corrosion (active)
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
plumb
steel - stainless
tin
Glass & Ceramic Materials
glass
ceramic (techno-)
1-part systems
epoxy resins
Solvents
solvent-free
Sector classification
manufacuting industry
Temperature resistance <0°C (approx.)
from -40°C
Temperature resistance >0°C (approx.)
to +140°C
to +160°C
Curing mechanisms
warm-/hot curing
Pot life @ +20/23°C - Minimum / hours
3-4 h
(Mixed) viscosity
high viscosity
thixotropic
Packaging unit
small packaging unit (can, tube, etc.)
cartridge (1- or 2-part)
customized packaging
Liquid Adhesives
1-part systems

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