EPOXONIC® 356
Bonding Technology
Highly flexible potting compound/adhesive for Automotive Engineering and Microelectronics.
EPOXONIC® 356 is especially suited for low stress potting of pressure sensitive electronic devices (e.g. inductive components, sensors) and for bonding of substrates with differences in CTE.
EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.
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