EPOXONIC® 356

Bonding Technology

Highly flexible potting compound/adhesive for Automotive Engineering and Microelectronics.

EPOXONIC® 356 is especially suited for low stress potting of pressure sensitive electronic devices (e.g. inductive components, sensors) and for bonding of substrates with differences in CTE.

Product Info

Features

Size of application area
µm²/³ range
mm²/³range
cm²/³ range
Thermoplastics
PA (PA 6.6)
PBT
Thermosetting Plastics
EP
HPL
Thermosets (Composites)
FR4
GRP
Elastomers
EPM/EPDM
Metals - susceptible to corrosion (active)
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
nickel
Glass & Ceramic Materials
glass
ceramic (techno-)
2-part systems
epoxy resins
Solvents
solvent-free
Sector classification
manufacuting industry
Temperature resistance <0°C (approx.)
from -40°C
Temperature resistance >0°C (approx.)
to +150°C
Shore-A
Sh-A 21 to 40
Sh-A 41 to 60
Colour of adhesive film
colour spectrum dark
black
Curing mechanisms
warm-/hot curing
Pot life @ +20/23°C - Minimum / hours
3-4 h
(Mixed) viscosity
high viscosity
Packaging unit
customized packaging
Liquid Adhesives
2-part systems

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