EPOXONIC® 356

Bonding Technology

Highly flexible potting compound/adhesive for Automotive Engineering and Microelectronics.

EPOXONIC® 356 is especially suited for low stress potting of pressure sensitive electronic devices (e.g. inductive components, sensors) and for bonding of substrates with differences in CTE.

Product Info
>EPOXONIC GmbH Reaktionsharzsysteme EPOXONIC GmbH Reaktionsharzsysteme
Bonding Technology

Features

Size of application area
µm²/³ range
mm²/³range
cm²/³ range
Thermoplastics
PA (PA 6.6)
PBT
Thermosetting Plastics
EP
HPL
Thermosets (Composites)
FR4
GRP
Elastomers
EPM/EPDM
Metals - susceptible to corrosion (active)
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
nickel
Glass & Ceramic Materials
glass
ceramic (techno-)
2-part systems
epoxy resins
Solvents
solvent-free
Sector classification
manufacuting industry
Temperature resistance <0°C (approx.)
from -40°C
Temperature resistance >0°C (approx.)
to +150°C
Shore-A
Sh-A 21 to 40
Sh-A 41 to 60
Colour of adhesive film
colour spectrum dark
black
Curing mechanisms
warm-/hot curing
Pot life @ +20/23°C - Minimum / hours
3-4 h
(Mixed) viscosity
high viscosity
Packaging unit
customized packaging
Liquid Adhesives
2-part systems

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