EPOXONIC® EX 2802
Bonding Technology
Highly flexible UV-adhesive for Microelectronics and Optoelectronics/Optics.
EPOXONIC® EX 2802 is especially suited for low stress bonding of substrates with different thermal expansion. EPOXONIC® EX 2802 features the possibility of quick fixation.
EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.
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