EPOXONIC® EX 2802

Bonding Technology

Highly flexible UV-adhesive for Microelectronics and Optoelectronics/Optics.

EPOXONIC® EX 2802 is especially suited for low stress bonding of substrates with different thermal expansion. EPOXONIC® EX 2802 features the possibility of quick fixation.

Product Info

Features

Size of application area
µm²/³ range
mm²/³range
cm²/³ range
Thermoplastics
PBT
Thermosetting Plastics
EP
Metals - anti corrosive surfaces (passive)
aluminium
steel - stainless
Glass & Ceramic Materials
glass
ceramic (techno-)
1-part systems
epoxy resins
Solvents
solvent-free
Sector classification
manufacuting industry
Temperature resistance <0°C (approx.)
from -30°C
Temperature resistance >0°C (approx.)
to +100°C
Shore-A
Sh-A 0 to 20
Colour of adhesive film
colourless
colour spectrum bright
yellow
Curing mechanisms
UV-/ light curing
Pot life @ +20/23°C - Minimum / minutes
1-5 min
(Mixed) viscosity
medium viscosity
Packaging unit
cartridge (1- or 2-part)
customized packaging
Liquid Adhesives
1-part systems

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