EPOXONIC® EX 2802

Bonding Technology

Highly flexible UV-adhesive for Microelectronics and Optoelectronics/Optics.

EPOXONIC® EX 2802 is especially suited for low stress bonding of substrates with different thermal expansion. EPOXONIC® EX 2802 features the possibility of quick fixation.

Product Info
EPOXONIC GmbH Reaktionsharzsysteme
Bonding Technology

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.

Features

Size of adhesive area
µm²-/µm³ range
mm²-/mm³range
cm²-/cm³ range
1-part systems
1-part epoxy resins
Solvents
solvent-free
Sector classification
manufacuting industry
Temperature resistance <0°C (approx.)
from -30°C
Temperature resistance >0°C (approx.)
to +100°C
Shore-A
Sh-A 0 to 20
Deformation capability
≤ 150%
Colour of adhesive film
colourless
colour spectrum bright
yellow
Curing mechanisms
UV-/ light curing
Pot life @ +20/23°C - Minimum / minutes
1-5 min
(Mixed) viscosity
medium viscosity
Packaging unit
cartridge (1- or 2-part)
customized packaging
Liquid Adhesives
1-part systems
Thermoplastics
PBT
Thermosetting Plastics
EP
Metals - anti corrosive surfaces (passive)
aluminium
steel - stainless
Glass & Ceramic Materials
glass
ceramic (techno-)

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