EPOXONIC® EX 3483

Bonding Technology

Flexible potting compound/adhesive with high thermal conductivity.

EPOXONIC® EX 3483 is especially suited for low stress potting of electrical and electronic devices and for thermal conductive bonding of heat sinks to electronic modules.

Product Info

Features

Size of application area
mm²/³range
cm²/³ range
Thermoplastics
PA (PA 6.6)
PBT
Thermosetting Plastics
EP
Thermosets (Composites)
FR4
GRP
Elastomers
EPM/EPDM
Metals - susceptible to corrosion (active)
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
steel - stainless steel
Glass & Ceramic Materials
ceramic (techno-)
2-part systems
epoxy resins
Solvents
solvent-free
Sector classification
manufacuting industry
Shore-A
Sh-A 61 to 80
Thermal conductivity
heat-conductive
Colour of adhesive film
colour spectrum bright
Curing mechanisms
warm-/hot curing
Pot life @ +20/23°C - Minimum / hours
1-2 h
(Mixed) viscosity
pasty
Packaging unit
small packaging unit (can, tube, etc.)
customized packaging
Liquid Adhesives
2-part systems

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