EPOXONIC® EX 3483

Bonding Technology

Flexible potting compound/adhesive with high thermal conductivity.

EPOXONIC® EX 3483 is especially suited for low stress potting of electrical and electronic devices and for thermal conductive bonding of heat sinks to electronic modules.

Product Info
EPOXONIC GmbH Reaktionsharzsysteme
Bonding Technology

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.

Features

Size of adhesive area
mm²-/mm³range
cm²-/cm³ range
Thermoplastics
PA (PA 6.6)
PBT
Thermosetting Plastics
EP
Thermosets (Composites)
FR4
GRP
Elastomers
EPM/EPDM
Metals - susceptible to corrosion (active)
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
steel - stainless
Glass & Ceramic Materials
ceramic (techno-)
2-part systems
2-part epoxy resins
Solvents
solvent-free
Sector classification
manufacuting industry
Shore-A
Sh-A 61 to 80
Deformation capability
≤ 150%
Thermal conductivity
heat-conductive
Colour of adhesive film
colour spectrum bright
Curing mechanisms
warm-/hot curing
Pot life @ +20/23°C - Minimum / hours
1-2 h
(Mixed) viscosity
pasty
Packaging unit
small packaging unit (can, tube, etc.)
customized packaging
Liquid Adhesives
2-part systems

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