EPOXONIC® EX 3525
Bonding Technology
Toughened 2-Part-Adhesive for Automotive Engineering, Microelectronics, and Electrical Engineering.
EPOXONIC® EX 3525 is especially suited for low stress bonding of substrates with different thermal expansion (e.g. polycarbonate/glass-composites).
EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.
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