EPOXONIC® EX 3525

Bonding Technology

Toughened 2-Part-Adhesive for Automotive Engineering, Microelectronics, and Electrical Engineering.

EPOXONIC® EX 3525 is especially suited for low stress bonding of substrates with different thermal expansion (e.g. polycarbonate/glass-composites).

Product Info

Features

Size of application area
µm²/³ range
mm²/³range
cm²/³ range
Thermoplastics
PA (PA 6.6)
PC
PET
PPS
Thermosetting Plastics
EP
HPL
Thermosets (Composites)
CRP
BMC
FR4
GRP
SMC
Metals - susceptible to corrosion (active)
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
steel - stainless
Glass & Ceramic Materials
glass
2-part systems
epoxy resins
Solvents
solvent-free
Sector classification
manufacuting industry
Temperature resistance <0°C (approx.)
from -40°C
Temperature resistance >0°C (approx.)
to +150°C
Shore-D
Sh-D 61 to 80
Curing mechanisms
room temperature curing
warm-/hot curing
Pot life @ +20/23°C - Minimum / hours
1-2 h
(Mixed) viscosity
high viscosity
Packaging unit
small packaging unit (can, tube, etc.)
customized packaging
Liquid Adhesives
2-part systems

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