EPOXONIC GmbH Reaktionsharzsysteme

Bonding Technology

EPOXONIC GmbH, synonymous for professional epoxy resins

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds. Together with our customers we develop individually adjusted systems that are easy to handle but nevertheless make no compromises concerning stability, reliability and long service life. Highlights are high-strength adhesives with outstanding chemical resistance and flexible, temperature resistant adhesives/potting compounds without anhydrides.

Gewerbestr. 16
85652 Landsham/Pliening (Munich)
Germany

Website

Products

>EPOXONIC® EX 3525 EPOXONIC® EX 3525
Bonding Technology

Toughened 2-Part-Adhesive for Automotive Engineering, Microelectronics, and Electrical Engineering.

>EPOXONIC® 195 EPOXONIC® 195
Bonding Technology

Dual-cure adhesive for Microelectronics and Optoelectronics/Optics.

>EPOXONIC® 333 EPOXONIC® 333
Bonding Technology

1-part adhesive for advanced demands on temperature stability.

>EPOXONIC® 276 EPOXONIC® 276
Bonding Technology

Thermal conductive adhesive for Automotive Engineering, Microelectronics and Electrical Engineering.

>EPOXONIC® EX 3483 EPOXONIC® EX 3483
Bonding Technology

Flexible potting compound/adhesive with high thermal conductivity.

>EPOXONIC® 292 EPOXONIC® 292
Bonding Technology

Tough adhesive for Automotive Engineering, Microelectronics, and Electrical Engineering.

>EPOXONIC® EX 2802 EPOXONIC® EX 2802
Bonding Technology

Highly flexible UV-adhesive for Microelectronics and Optoelectronics/Optics.

>EPOXONIC® 356 EPOXONIC® 356
Bonding Technology

Highly flexible potting compound/adhesive for Automotive Engineering and Microelectronics.

>EPOXONIC® EX 3617 EPOXONIC® EX 3617
Bonding Technology

1-Part adhesive for advanced demands on temperature stability.

>EPOXONIC® 347 EPOXONIC® 347
Bonding Technology

Flexible potting compound/adhesive with high thermal conductivity.