Araldite® 2015-1

Bonding Technology

Araldite® 2015-1 is a two component, room temperature curing paste adhesive giving a resilient bond.

It is thixotropic and non-sagging up to 10 mm thickness. It is particularly suitable for SMC and GRP bonding.

  • Toughened paste
  • Ideal for bonding GRP, SMC and dissimilar substrates
  • Gap filling, non-sagging up to 10mm thickness
  • Good resistance to weathering
Product Info
>Huntsman Advanced Materials (CH) GmbH Huntsman Advanced Materials (CH) GmbH
Bonding Technology

Whatever bonding task is in front of you, you can rely on the ARALDITE® adhesives

Features

Size of application area
cm²/³ range
m²/³ range
Thermoplastics
PA
PC
PMMA
PUR (lower degree of cross-linking)
PVC (harder perfomance)
PVC (softer perfomance)
Thermoplastics (Styrenes)
ABS
Thermosetting Plastics
EP
PF
UP
Thermosets (Composites)
CRP
FR4
GRP
SMC
Metals - susceptible to corrosion (active)
copper
brass
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
silicium
steel - stainless steel
2-part systems
epoxy resins
Sector classification
manufacuting industry
Temperature resistance >0°C (approx.)
to +100°C
Deformation capability
≤ 10%
Gap filling properties
> 5mm
Colour of adhesive film
colour spectrum bright
hull
several bondings - hull
exteriors
windows
deck structures
Curing mechanisms
room temperature curing
Pot life @ +20/23°C - Minimum / minutes
31-59 min
(Mixed) viscosity
high viscosity
thixotropic
Packaging unit
cartridge (1- or 2-part)
Application Types
dot application
line, bead application
Liquid Adhesives
2-part systems

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