KAGER Industrieprodukte GmbH

Bonding Technology

Your aims and objectives are the focal point for our team when you consult with us. If you are looking for solutions in the areas of production, construction, development, research, servicing & maintenance, laboratory and trade, we are here to help you.

Paul-Ehrlich-Straße 10a
DE-63128 Dietzenbach
Germany

Information Desk

Products

Cerama-Dip 538-N - Anorganic Ceramic Coating
Bonding Technology

High temperature coating material and a chemically bonded mixture for coatings of ceramics, quartz, refractory materials and metals.

Ceramabond 571 – High Temperature Ceramic Adhesive
Bonding Technology

High temperature ceramic adhesive, filled with magnesium oxide, for applications in the field of heating elements, induction coils and sensors.

Pyro-Putty 2400 – Repair paste til 1090 °C
Bonding Technology

Inorganic paste filled with ceramics and stainless steel for sealing and repairing cast iron, steel, stainless steel.

Ceramacast 586 – Pourable Ceramic
Bonding Technology

Pourable ceramic with water binding for ceramic and metal assemblies. Excellent handling.

Aremco-Bond 2310 – High Temperature Epoxy
Bonding Technology

2-part system 1:1 with ceramic filling, high shear strength and pull resistance, autoclav suited.

Ceramabond 671 – High Temperature Ceramic Adhesive
Bonding Technology

One-part high-temperature ceramic adhesive, filled with aluminum oxide, for the assembly of high-temperature thermocouple housings in ovens and boilers.

Pyro-Paint 634-ZO – 1-part based on zirconium oxide
Bonding Technology

1-part protective coating based on zirconium oxide for the sealing of porous ceramics, also stable with aluminium, molybdenum, platinum, rhodium and titanium.

Pyro Duct 597-A – 1-part system with silver-aggregates
Bonding Technology

1-part system with silver filling, inorganic system for bonding applications up to 927 °C.

Ceramacast 575-N
Bonding Technology

Fine-grained casting for pouring and creating small workpieces.

Aremco-Bond 526-N - High Temperature Epoxy
Bonding Technology

2-part system in the mixing ratio 1:1 for demanding adhesive applications for the temperature range from –60°C to +300°C.