Polytec EP 630

Bonding Technology

Polytec EP 630 is a 100% solid, two-component, low viscosity, high temperature adhesive underfill and encapsulation. Polytec EP 630 provides excellent high temperature, chemical, electrical and moisture resistance. It was designed for semiconductor, medical, hybrid, piezo, fiberoptics, HV and UHV applications. It has an excellent adhesion to silicon, glass, metal, ceramic, ferrite and most plastics and can be used as low viscosity adhesive, epoxy impregnation, underfill and encapsulation. More over the Polytec EP 630 complies to USP Class VI Biocompatibility Standards. The material can be applied via dispensing, jet-dispensing and manual application.

Product Info
>Polytec PT GmbH Polytec PT GmbH
Bonding Technology

The POLYTEC PT GmbH develops, manufactures and sells special adhesives for applications in the electronics, electrical engineering, medical technology and optics.

Features

Size of application area
µm²/³ range
mm²/³range
cm²/³ range
Thermoplastics
PA
PBT
PES
PET
PSU
Thermoplastics (low surface energy)
POM
Thermoplastics (Styrenes)
ABS
PPE
PS
SB
Thermosetting Plastics
EP
Thermosets (Composites)
CRP
FR4
GRP
Metals - susceptible to corrosion (active)
cast iron
copper
brass
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
gold
silicium
steel - chromated
steel - stainless steel
steel - galvanised
tin
Glass & Ceramic Materials
glass
ceramics
2-part systems
epoxy resins
biocompatibility
USP class VI/ISO 10993
Sector classification
manufacuting industry
Temperature resistance <0°C (approx.)
from -55°C
Temperature resistance >0°C (approx.)
to +220°C
Shore-D
Sh-D 81 to 100
Deformation capability
≤ 10%
Colour of adhesive film
colour spectrum bright
microelectronics / optics / sensor systems
sensor bondings
medical equipment & accessories
several bondings - medical equipments
Curing mechanisms
warm-/hot curing
Pot life @ +20/23°C - Minimum / hours
> 12 h
(Mixed) viscosity
medium viscosity
Packaging unit
small packaging unit (can, tube, etc.)
customized packaging
Application Types
dot application
line, bead application
Liquid Adhesives
2-part systems

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