Polytec PT GmbH

Bonding Technology

The POLYTEC PT GmbH develops, manufactures and sells special adhesives for applications in the electronics, electrical engineering, medical technology and optics. The product portfolio includes electrically or thermally conductive adhesives, transparent adhesive for optics and fiber optics, UV-curable adhesives based on epoxy resins, polyurethanes and acrylics. In addition to an extensive range of standard products, POLYTEC PT designs and manufactures customized adhesives for specific requirements.

Ettlinger Str. 30
DE-76307 Karlsbad
Germany

Website

Information Desk

Products

Polytec EP 630 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 630 is a 100% solid, two-component, low viscosity, high temperature adhesive, underfill and encapsulation.

Polytec EP 610 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 610 is a transparent, two-component epoxy adhesive of very low viscosity and high flexibility. It is suggested for applications in optics, fiber optics, optoelectronics, medical and semiconductor technology.

Polytec TC 301 - Thermally Conductive Adhesive
Bonding Technology

Polytec TC 301 is a standard single component, metal filled, heat curing epoxy adhesive with excellent thermal conductivity.

Polytec EP 660 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 660 is a 100% solid, two-component, low viscosity, high temperature and high Tg epoxy, impregnation and coating material.

Polytec TC 430 - Thermally Conductive Adhesive
Bonding Technology

Polytec TC 430 is a two component, thermally conductive, electrically insulating epoxy. It is suggested for applications where heat dissipation and insulating properties are required.

Polytec EP 601 - Unfilled Epoxy Adhesive
Bonding Technology

Two-component transparent, , optically clear epoxy adhesive of very low viscosity.

Polytec TC 417 - Thermally Conductive Adhesive
Bonding Technology

Polytec TC 417 is a two component, thermally conductive, electrically insulating epoxy. It is used in various thermal management applications, especially for potting of large volumes.

Polytec TC 411 - Thermally Conductive Adhesive
Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

Polytec UV 2195 - UV light curing acrylate adhesive
Bonding Technology

Polytec UV 2195 is a fast curing, single component, UV-/Visible light curable, medium viscosity acrylic adhesive. It is suitable for impact and vibration resistant bonds.

Polytec EC 101 - Electrically Conductive Adhesive
Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

Polytec PU 1000 - Electrically Conductive Polyurethane Adhesive
Bonding Technology

1-part room-temperature curing, highly flexible polyurethane-adhesive with excellent electrical conductivity. It is used in micro electronics, hybrid and electronic applications.