Polytec TC 301 - Thermally Conductive Adhesive

Bonding Technology

Polytec TC 301 is a standard single component, metal filled, heat curing epoxy adhesive with excellent thermal conductivity. It was designed for all applications where heat transfer is essential (heat-sinking, aluminum or ceramic packaging etc.).

Polytec TC 301 has a conveniently long pot- and shelf life and is ideal for all dispensing and screen printing applications. TC 301 has an excellent adhesion on metals, ceramic, glass and most plastics. The material can be applied by dispensing or screen and stencil printing.

Product Info
Polytec PT GmbH
Bonding Technology

The POLYTEC PT GmbH develops, manufactures and sells special adhesives for applications in the electronics, electrical engineering, medical technology and optics.

Features

Size of adhesive area
µm²-/µm³ range
mm²-/mm³range
cm²-/cm³ range
1-part systems
1-part epoxy resins
Sector classification
manufacuting industry
Temperature resistance <0°C (approx.)
from -55°C
Temperature resistance >0°C (approx.)
to +180°C
Shore-D
Sh-D 81 to 100
Deformation capability
≤ 10%
Thermal conductivity
heat-conductive
Colour of adhesive film
colour spectrum bright
Curing mechanisms
warm-/hot curing
Pot life @ +20/23°C - Minimum / days
> 2 d
(Mixed) viscosity
pasty
Packaging unit
customized packaging
Application Types
dot application
line, bead application
Liquid Adhesives
1-part systems
High Performance Plastics
PSU
PES
Thermoplastics
PA
PBT
PET
Thermoplastics (Styrenes)
ABS
PPE
PS
SB
Thermosetting Plastics
EP
Thermosets (Composites)
CRP
FR4
GRP
Metals - susceptible to corrosion (active)
copper
Metals - anti corrosive surfaces (passive)
aluminium
plumb
nickel
steel - chromated
steel - stainless
steel - galvanised
zinc (also galvanized materials)
tin
Glass & Ceramic Materials
ceramics

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