Polytec TC 411 - Thermally Conductive Adhesive

Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

Polytec TC 411 has a great thermal conductivity and an excellent adhesion to ceramic, glass, semiconductor materials, metals and most plastics. The application can be performed directly from the side-by-side cartridge with a static mixing nozzle, using a dispensing gun.

Product Info
>Polytec PT GmbH Polytec PT GmbH
Bonding Technology

The POLYTEC PT GmbH develops, manufactures and sells special adhesives for applications in the electronics, electrical engineering, medical technology and optics.

Features

Size of adhesion surface
µm²-/µm³ range
mm²-/mm³range
cm²-/cm³ range
Thermoplastics
PA
PA (PA 6)
PA (PA 6.6)
PA (PA 12)
PBT
PC
PES
PET
PSU
PUR (lower degree of cross-linking)
PVC (softer perfomance)
Thermoplastics (low surface energy)
PE-HD (High Density)
PE-LD (Low Density)
PP
POM
Thermoplastics (Styrenes)
ABS
ASA
EPS
PPE
PS
SAN
SB
XPS (rigid foam)
Thermosetting Plastics
EP
HPL
MF
PF
PUR (higher degree of cross-linking)
UP
Thermosets (Composites)
CRP
BMC
FR4
GRP
SMC
Elastomers
CR
EPM/EPDM
NBR
NR
SBR
Metals - susceptible to corrosion (active)
bronze
cast iron
copper
magnesium
brass
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
plumb
chromium
gold
nickel
platinum
silver
silicium
steel - chromated
steel - stainless
steel - galvanised
titanium
zinc (also galvanized materials)
tin
Glass & Ceramic Materials
emaille
glass
ceramics
ceramic (techno-)
mosaic & tiles
2-part systems
epoxy resins
Sector classification
manufacuting industry
Temperature resistance <0°C (approx.)
from -55°C
Temperature resistance >0°C (approx.)
to +120°C
Shore-D
Sh-D 21 to 40
Deformation capability
≤ 30%
Electrical conductivity
electrically conductive
Colour of adhesive film
colour spectrum bright
white
microelectronics / optics / sensor systems
components & housings
sensor bondings
energy supply
several bondings - energy
Curing mechanisms
room temperature curing
Pot life @ +20/23°C - Minimum / hours
1-2 h
(Mixed) viscosity
pasty
Packaging unit
cartridge (1- or 2-part)
customized packaging
Degree of automation
hand-operated application
semi automatic
Application Types
dot application
line, bead application
Liquid Adhesives
2-part systems

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