Polytec TC 411 - Thermally Conductive Adhesive
Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.
Polytec TC 411 has a great thermal conductivity and an excellent adhesion to ceramic, glass, semiconductor materials, metals and most plastics. The application can be performed directly from the side-by-side cartridge with a static mixing nozzle, using a dispensing gun.
The POLYTEC PT GmbH develops, manufactures and sells special adhesives for applications in the electronics, electrical engineering, medical technology and optics.