Polytec TC 430

Bonding Technology

Polytec TC 430 is a two component, thermally conductive, electrically insulating epoxy. It is suggested for applications where heat dissipation and insulating properties are required. Typical applications:

  • Attaching heat sinks
  • Die attach
  • Die bonding power devices
  • Thermally conductive underfill Polytec TC 430 has an excellent adhesion to ceramic, glass, semiconductor materials, ferrous and non-ferrous metals and most plastics. The material can be applied via dispensing, screen printing, or manual application.
Product Info
>Polytec PT GmbH Polytec PT GmbH
Bonding Technology

The POLYTEC PT GmbH develops, manufactures and sells special adhesives for applications in the electronics, electrical engineering, medical technology and optics.

Features

Size of application area
µm²/³ range
mm²/³range
cm²/³ range
Thermoplastics
PA
PA (PA 6)
PA (PA 6.6)
PA (PA 12)
PBT
PC
PES
PET
PMMA
PSU
PUR (lower degree of cross-linking)
PVC (harder perfomance)
PVC (softer perfomance)
Thermoplastics (low surface energy)
PE-HD (High Density)
PE-LD (Low Density)
PP
POM
Thermoplastics (Styrenes)
ABS
ASA
EPS
PPE
PS
SAN
SB
XPS (rigid foam)
Thermosetting Plastics
EP
HPL
MF
PF
PUR (higher degree of cross-linking)
UP
Thermosets (Composites)
CRP
BMC
FR4
GRP
SMC
Elastomers
CR
EPM/EPDM
NBR
NR
SBR
Metals - susceptible to corrosion (active)
bronze
cast iron
copper
magnesium
brass
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
plumb
chromium
gold
nickel
platinum
silver
silicium
steel - chromated
steel - stainless
steel - galvanised
titanium
zinc (also galvanized materials)
tin
Glass & Ceramic Materials
emaille
glass
ceramics
mosaic & tiles
porcelain
2-part systems
epoxy resins
Solvents
solvent-free
Sector classification
manufacuting industry
Temperature resistance <0°C (approx.)
from -55°C
Temperature resistance >0°C (approx.)
to +250°C
Shore-D
Sh-D 81 to 100
Deformation capability
≤ 10%
Thermal conductivity
heat-conductive
Colour of adhesive film
yellow
microelectronics / optics / sensor systems
components & housings
Pot life @ +20/23°C - Minimum / days
> 2 d
(Mixed) viscosity
high viscosity
thixotropic
Packaging unit
customized packaging
Application Types
dot application
line, bead application
Liquid Adhesives
2-part systems

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The search results from SUBSTRATEC are not sales recommendations and/or professional technical advice. It is only intended to make it easier for the user to pre-select suitable adhesives that may be available. SUBSTRATEC gives no guarantee that the adhesive suggested is successful or suitable for the specific area of application of the user. In the event of any questions regarding the use and suitability for the specific application, the user has the possibility to directly contact the respective technical contact person of the relevant adhesive manufacturer or supplier. See for further information Terms of Use.