Three Bond 2217H

Bonding Technology

Three Bond 2217H is a one-component epoxy resin and is characterized by its short cure times. Its rheological properties make it suitable for fully automated and screen printing applications.

Excellent electrical properties, excellent chemical and thermal resistance, combined with the possibility of rapid application and curing at low temperatures as 80°C, make Three Bond 2217H the ideal choice when it comes to SMD applications and PCB assembly with chips, QFPs and other components.

Product Info
Three Bond GmbH
Bonding Technology

“Creating Our Future From a Single Drop”

Features

Size of adhesion surface
µm²-/µm³ range
mm²-/mm³range
cm²-/cm³ range
Thermoplastics
PBT
PC
PET
PMMA
PVC (harder perfomance)
Thermosetting Plastics
EP
Thermosets (Composites)
CRP
BMC
FR4
GRP
SMC
Metals - susceptible to corrosion (active)
cast iron
copper
magnesium
brass
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
magnets
steel - stainless
zinc (also galvanized materials)
Glass & Ceramic Materials
glass
1-part systems
epoxy resins
Solvents
solvent-free
Sector classification
manufacuting industry
Temperature resistance <0°C (approx.)
from -40°C
Temperature resistance >0°C (approx.)
to +150°C
Shore-D
Sh-D 81 to 100
Deformation capability
≤ 10%
Colour of adhesive film
colour spectrum bright
red
chipbonden
die-attach
flip-chip
underfiller
Curing mechanisms
warm-/hot curing
(Mixed) viscosity
pasty
thixotropic
Packaging unit
small packaging unit (can, tube, etc.)
cartridge (1- or 2-part)
Degree of automation
fully automated
Application Types
dot application
line, bead application
surface coating
Liquid Adhesives
1-part systems

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