Three Bond 2270J
Three Bond 2270J is a one-component epoxy resin with excellent thermal conductivity. Like most epoxy resins, it is suitable for a wide range of material combinations and it already cures at moderate temperatures.
Furthermore, it can be processed well with common dosing systems in automated or manual processes. Low shrinkage and a low thermal expansion coefficient, as well as good thermal and moisture resistance, make Three Bond 2270J the ideal choice when it comes to heat dissipation in electrical and electronic components.
“Creating Our Future From a Single Drop”