Three Bond 2270J
Three Bond 2270J is a one-component epoxy resin with excellent thermal conductivity. Like most epoxy resins, it is suitable for a wide range of material combinations and it already cures at moderate temperatures.
Furthermore, it can be processed well with common dosing systems in automated or manual processes. Low shrinkage and a low thermal expansion coefficient, as well as good thermal and moisture resistance, make Three Bond 2270J the ideal choice when it comes to heat dissipation in electrical and electronic components.