Three Bond 2270J

Bonding Technology

Three Bond 2270J is a one-component epoxy resin with excellent thermal conductivity. Like most epoxy resins, it is suitable for a wide range of material combinations and it already cures at moderate temperatures.

Furthermore, it can be processed well with common dosing systems in automated or manual processes. Low shrinkage and a low thermal expansion coefficient, as well as good thermal and moisture resistance, make Three Bond 2270J the ideal choice when it comes to heat dissipation in electrical and electronic components.

Product Info
Three Bond GmbH
Bonding Technology

“Creating Our Future From a Single Drop”

Features

Size of adhesive area
mm²-/mm³range
cm²-/cm³ range
Thermoplastics
PBT
PC
PET
PMMA
PVC (harder perfomance)
Thermosetting Plastics
EP
Thermosets (Composites)
CRP
BMC
FR4
GRP
SMC
Metals - susceptible to corrosion (active)
cast iron
copper
magnesium
brass
steel (blasted SA 2,5)
Metals - anti corrosive surfaces (passive)
aluminium
magnets
steel - stainless
zinc (also galvanized materials)
Glass & Ceramic Materials
glass
1-part systems
epoxy resins
Solvents
solvent-free
Sector classification
manufacuting industry
Temperature resistance <0°C (approx.)
from -40°C
Temperature resistance >0°C (approx.)
to +130°C
Shore-D
Sh-D 81 to 100
Deformation capability
≤ 10%
Thermal conductivity
heat-conductive
Colour of adhesive film
colour spectrum bright
white
Mobility - Land Transportation
vehicle electronics
Curing mechanisms
room temperature curing
(Mixed) viscosity
pasty
Packaging unit
small packaging unit (can, tube, etc.)
Degree of automation
hand-operated application
fully automated
Application Types
dot application
line, bead application
surface coating
Liquid Adhesives
1-part systems

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