EPOXONIC® 356 - flexible

Casting Potting

Highly flexible potting compound/adhesive for automotive technology and microelectronics.

EPOXONIC® 356 is a solvent-free, flexibilized two-component epoxy resin system. EPOXONIC® 356 is particularly suitable for the low-stress potting of electronic components as well as for the bonding of substrates with different thermal strains.

Key features:

  • Continuous temperature resistance up to 150 °C
  • Thermal shock resistance
  • High elongation at break
  • Flexibility
  • Long service life transparency
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EPOXONIC GmbH Reaktionsharzsysteme
Adhesive Bonding Technology

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.

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Features

Sector expertise
Manufacuting industry
Adhesive and sealant systems
Adhesive
Potting
Components
2-part systems
2-part systems
2-part epoxy resins
Size of application area
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
hot curing
Pot life @ +20/23°C - Minimum / hours
> 12 h
(Mixed) viscosity
medium viscosity
Packaging unit
customized packaging
temperature resistance <0°C (approx.)
from -40°C
from -30°C
from -20°C
temperature resistance >0°C (approx.)
to +130°C
to +140°C
to +150°C
colour and colour fastness
black
Shore-A
Sh-A 21 to 40
Sh-A 41 to 60
deformation capability
≤ 150%
Machine & Production Engineering / electrical engineering
casting of components

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