Chipbonden - bonding of die-attach
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Manual or semi-automated enclosed systems for lower volume, specialised or R&D applications.
Flexible, automated production for CO2 snow-jet cleaning; inline, stand-alone and application specific configurations.
One-component epoxy resin with short cure times. Its rheological properties make it suitable for fully automated and screen printing applications.