Project Support – Adhesive Bonding Processes
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Polytec EC 101 - Electrically Conductive Adhesive
Bonding Technology
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Three Bond 2217H
Bonding Technology
One-component epoxy resin with short cure times. Its rheological properties make it suitable for fully automated and screen printing applications.