Chipbonden - bonding of flip-chip
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Do your company’s projects require surface pretreatment, application systems or adhesive technologies? Is there a need for further training for hand-operated or robotic bonding processes?
One-component epoxy resin with short cure times. Its rheological properties make it suitable for fully automated and screen printing applications.