Chipbonden - bonding of underfiller

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Polytec EP 630 - Unfilled Epoxy Adhesive
Adhesive Bonding Technology

Polytec EP 630 is a 100% solid, two-component, low viscosity, high temperature adhesive, underfill and encapsulation.

Three Bond 2217H
Adhesive Bonding Technology

One-component epoxy resin with short cure times. Its rheological properties make it suitable for fully automated and screen printing applications.

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