Engine & drive technology - stator pottings
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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MECOFLOCK® L 860 is a two-component solvent-based adhesive for spray- and roller-application used for the flocking of many metals and plastic and various other substrates requiring high quality characteristics when flocked.
KIWOTHERM® D 123 is a screen printable, heat activated adhesive for the bonding of plastic film to one another, or to paper, cardboard and textiles.
MECOFLOCK® L 844 series is a two-component solvent-based adhesive for screenprinting, spray- and roller application used for the flocking of many metals and plastic and various other substrates requiring high quality characteristics when flocked.
Polytec TC 417-2 is a two component, thermally conductive, electrically insulating epoxy. It is used in various thermal management applications, especially for potting of large volumes.
MECOFLOCK® D 535 is especially suitable for the flocking of PU-Integrated foam material, for which the preservation of its elasticity is the first goal.