Vehicle electronics - bonding of control technology elements
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
KIWOTHERM® D 123 is a screen printable, heat activated adhesive for the bonding of plastic film to one another, or to paper, cardboard and textiles.
KIWOPRINT® UV Series is a high quality, pressure sensitive adhesive for the production of self-adhesive components made of rigid PVC, glass metal and film made of polycarbonate, polyester and pre-treated polyethylene and polypropylene.
Born2Bond™ Structural is a high-strength hybrid adhesive that provides a fast fixture time at room temperature while maintaining good processability and bond gaps up to 5mm.
KIWOPRINT® D 159 NF is a high quality, screen printable pressure sensitive adhesive for the production of self-adhesive materials for the automotive and electronic industry (e.g. touch panels, visual instrument panels, front panels, electrical devices) when high peel strength is required.