Vehicle electronics - bonding of control technology elements
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
Born2Bond™ HMPUR HHD 6002 is a high performance adhesive that stands out with high production efficiency, excellent humidity, sebum, temperature and impact resistance.
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Born2Bond™ Structural is a high-strength hybrid adhesive that provides a fast fixture time at room temperature while maintaining good processability and bond gaps up to 5mm.
Born2Bond™ Light Lock HV is a low-odor, low-blooming, dual curing (contact and lightcuring), cyanoacrylate adhesives.
Born2Bond™ Repair is a patented, gap-filling, instant adhesive and repair product with excellent adhesion to a very broad range of materials and surfaces.