Vehicle electronics - bonding of control technology elements
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Features
control technology elements
Preview results
Born2Bond™ HMPUR HHD 6002
Adhesive Bonding Technology
High performance HMPUR with high initial bonding strength and excellent environmental resistance.
Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Born2Bond™ Light Lock HV
Adhesive Bonding Technology
Instant adhesive with dual cure system (light curing).
