Vehicle electronics - bonding of plugs
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Instant adhesive with dual cure system (light curing).
Polytec TC 417-2 is a two component, thermally conductive, electrically insulating epoxy. It is used in various thermal management applications, especially for potting of large volumes.
Labelfree, low blooming, high viscous instant adhesive.