Project Support – Adhesive Bonding Processes
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Silver (Ag) is a chemical element of the 5th period. It is characterized by the highest electrical conductivity of all elements and the highest thermal conductivity of all metals. Silver is one of the soft and malleable metals. Like all precious metals, silver is one of the heavy metals. In most cases silver is won from ores of copper, copper-nickel, lead or lead-zinc but also a refining of silver (electrolytic copper cleaning). © 2021 SUBSTRATEC. All Rights Reserved.
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Bonds immediately, is the new generation of the mounting adhesive, is not shrinking, is very well suited for natural stones, hardens quickly.
Low odor, permanently elastic, wet on wet applicable, good resistance to oils, fats, water, aliphatic solvents etc.
Medium viscosity black rubber toughened cyanoacrylate adhesive. It gives fast cures on the majority of industrial substrates and is particularly suitable for bonding rubbers, metals and plastics.