Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

NBR

Acrylonitrile-butadiene rubber or nitrile rubber is a material of the monomers acrylonitrile and 1,3-butadiene which belongs to the group of synthetic rubbers. Nitrile rubber vulcanization products are highly resistant to oils, fuel and aliphatic hydrocarbons. The proportion of acrylonitrile can vary greatly and thus affect properties such as cold flexibility or swelling resistance. It is often used in disposable lab or cleaning gloves. © 2021 SUBSTRATEC. All Rights Reserved.

silver

Silver (Ag) is a chemical element of the 5th period. It is characterized by the highest electrical conductivity of all elements and the highest thermal conductivity of all metals. Silver is one of the soft and malleable metals. Like all precious metals, silver is one of the heavy metals. In most cases silver is won from ores of copper, copper-nickel, lead or lead-zinc but also a refining of silver (electrolytic copper cleaning). © 2021 SUBSTRATEC. All Rights Reserved.


Preview results

MD MK 3000
Adhesive Bonding Technology

Bonds immediately, is the new generation of the mounting adhesive, is not shrinking, is very well suited for natural stones, hardens quickly.

MD MS 2K Polymer
Adhesive Bonding Technology

Low odor, permanently elastic, wet on wet applicable, good resistance to oils, fats, water, aliphatic solvents etc.

MD MS Polymer
Adhesive Bonding Technology

Fast curing, odorless, wet on wet applicable, sanded.

Polytec PU 1000 - Electrically Conductive Polyurethane Adhesive
Adhesive Bonding Technology

1-part room-temperature curing, highly flexible polyurethane-adhesive with excellent electrical conductivity. It is used in micro electronics, hybrid and electronic applications.

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

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