Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

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Polyisoprene (natural rubber)

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Magnets


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Bylamet RB-35
Adhesive Bonding Technology

Medium viscosity black rubber toughened cyanoacrylate adhesive. It gives fast cures on the majority of industrial substrates and is particularly suitable for bonding rubbers, metals and plastics.

Bylamet MQ
Adhesive Bonding Technology

Specially for bonding different kinds of wood and leather, 100 ~ 2000 mPas.

Bylamet SVQ
Adhesive Bonding Technology

Fastest setting type, bonding of balsa too, in a few seconds, 3 mPas.

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

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