Bonding aluminium to aluminium

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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aluminium

Aluminium


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Polytec EP 610 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 610 is a transparent, two-component epoxy adhesive of very low viscosity and high flexibility. It is suggested for applications in optics, fiber optics, optoelectronics, medical and semiconductor technology.

Polytec EC 101 - Electrically Conductive Adhesive
Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

Flex 310 M® HT 200 MS-Polymer
Bonding Technology

Adhesive and sealant with high initial adhesion | temperature resistant.

Three Bond 1160B
Bonding Technology

New one-component moisture-curing acrylic-based elastic adhesive!

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