Bonding platinum to silver
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Silver (Ag) is a chemical element of the 5th period. It is characterized by the highest electrical conductivity of all elements and the highest thermal conductivity of all metals. Silver is one of the soft and malleable metals. Like all precious metals, silver is one of the heavy metals. In most cases silver is won from ores of copper, copper-nickel, lead or lead-zinc but also a refining of silver (electrolytic copper cleaning). © 2021 SUBSTRATEC. All Rights Reserved.
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.
Vibration-resistant, one-component – clean and easy to apply, suitable for all thread types and shapes, seals inside the thread immediate.
Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.