Bonding gold to PA 12

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Features

PA (PA 12)

Polyamide 12

gold

Gold is a chemical element. It has the element symbol Au and the atomic number 79. It stands in the periodic table of the elements in the 1st subgroup (copper group) and belongs to the transition metals. Gold was one of the first metals processed by humans. More than 40 percent of the gold mined comes from China, Australia, the United States and Canada. Gold most often occurs as a native metal in nature. © 2021 SUBSTRATEC. All Rights Reserved.


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Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

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Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

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Adhesive Bonding Technology

MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.

Polytec TC 411 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

tesa® ACXplus 7808 Black Line
Adhesive Bonding Technology

0.8 mm double-sided acrylic foam tape for mounting automotive exterior trims and parts.

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