Bonding magnets to PA 12
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
Double-sided pressure sensitive adhesive tape with a white polyethylene foam carrier and an aggressive synthetic rubber adhesive.
Double-sided pressure sensitive adhesive tape coated with a high-performance Rubber adhesive.