Bonding PA to PA
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Polyamide
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Born2Bond™ HMPUR HHD 6002 is a high performance adhesive that stands out with high production efficiency, excellent humidity, sebum, temperature and impact resistance.
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.
For universal application with a wide variety of materials. REACH registered.