Bonding magnesium to PBT

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

PBT

Polybutyleneterephthalate

magnesium

Magnesium


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Polytec EP 610 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 610 is a transparent, two-component epoxy adhesive of very low viscosity and high flexibility. It is suggested for applications in optics, fiber optics, optoelectronics, medical and semiconductor technology.

Polytec EC 101 - Electrically Conductive Adhesive
Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

KEOL-UV 278
Bonding Technology

KEOL-UV 278-80K adhesive has been specially developed for bonding plastic materials. Its big flexibility allows it to compensate for the differential expansion forces between the assembled parts.

KEOL-EP 261
Bonding Technology

A versatile easy to use solvent free epoxy adhesive, which can be used to bond or repair most materials such as wood, metal, glass, ceramic, plastics and rubbers.

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