Bonding brass to PC
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Features
Polycarbonate
Brass
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Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.
Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.
Through the research & development of MS Polymers a success story in bonding technology has been reinvigorated combining the properties of conventional bonding systems like polyurethanes, silicones and acrylates, without the necessity of keeping their weak points.