Bonding ASA to PC
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
Born2Bond™ HMPUR HHD 6002 is a high performance adhesive that stands out with high production efficiency, excellent humidity, sebum, temperature and impact resistance.
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
Double-sided pressure sensitive adhesive mounting tape with a modified acrylic adhesive and a compressible foam carrier.