Bonding copper to PMMA
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Features
Polymethyl methacrylate
Copper
Preview results
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
Through the research & development of MS Polymers a success story in bonding technology has been reinvigorated combining the properties of conventional bonding systems like polyurethanes, silicones and acrylates, without the necessity of keeping their weak points.
Kisling's 1670 is a non-sagging, two-part methylmethacrylate adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.
Two component, room temperature curing, toughened methacrylate adhesive system with an open time of 10 minutes.