Bonding ABS to CR
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
Acrylonitrile butadiene styrene
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Bonds immediately, is the new generation of the mounting adhesive, is not shrinking, is very well suited for natural stones, hardens quickly.
Low odor, permanently elastic, wet on wet applicable, good resistance to oils, fats, water, aliphatic solvents etc.
Only a few drops of this super-fast instant glue suffice for most applications in order to achieve powerful assemblies. The practical PE-bottles make possible a dot-like accurate application of the adhesive onto the parts to be bonded.