Bonding ASA to SAN

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

Search engine for adhesives technologies >>>

Search engine for surface technologies >>>

Search engine for processing systems >>>


Features

ASA

Acrylic ester-styrene-acrylonitrile

SAN

Styrene / acrylonitrile


Preview results

Polytec EP 610 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 610 is a transparent, two-component epoxy adhesive of very low viscosity and high flexibility. It is suggested for applications in optics, fiber optics, optoelectronics, medical and semiconductor technology.

Polytec EC 101 - Electrically Conductive Adhesive
Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

ergo.® 5923
Bonding Technology

Medium to high viscous and nearly odourless glue, which shows less blooming or whitening than normal grades. Suitable for bonding of jewellery or crystal into carrier and recommended, wherever visible traces of glue must be avoided.

DuploCOLL® 5015
Bonding Technology

Double-sided pressure sensitive adhesive mounting tape with a modified acrylic adhesive and a compressible foam carrier.

More results

» See more results