Project Support – Adhesive Bonding Processes
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
Polystyrene (PS) is usually obtained by chain polymerization of styrene. It is an aromatic polymer and belongs to the group of thermoplastics. The tacticity describes the position of the phenyl group in the polymer. The position can be random, alternating or even. Depending on which case PS is divided into atactic, syndiotactic and isotactic PS. This determines whether the plastic is amorphous or semi-crystalline. PS is often used for disposable plastics, CD cases etc. © 2021 SUBSTRATEC. All Rights Reserved.
Gold is a chemical element. It has the element symbol Au and the atomic number 79. It stands in the periodic table of the elements in the 1st subgroup (copper group) and belongs to the transition metals. Gold was one of the first metals processed by humans. More than 40 percent of the gold mined comes from China, Australia, the United States and Canada. Gold most often occurs as a native metal in nature. © 2021 SUBSTRATEC. All Rights Reserved.
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.
Bonds immediately, is the new generation of the mounting adhesive, is not shrinking, is very well suited for natural stones, hardens quickly.