Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

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Styrene / butadiene

steel - chromated

Steel - chromated


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

DuploCOLL® 5015
Adhesive Bonding Technology

Double-sided pressure sensitive adhesive mounting tape with a modified acrylic adhesive and a compressible foam carrier.

DuploCOLL® 50001 LSE
Adhesive Bonding Technology

Double-sided pressure sensitive adhesive tape with a white polyethylene foam carrier and an aggressive synthetic rubber adhesive.

Polytec TC 411 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

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