Bonding XPS to XPS rigid foam
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
Extruded polystyrene (rigid foam)
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
Applications include acoustic insulation, HVAC seals, gaskets, electrical devices, seats, doors, anti rattle tapes, spacers, decorative trims, pillars, roofs and headliners plus others.
Double-sided pressure sensitive adhesive mounting tape with a modified acrylic adhesive and a compressible foam carrier.