Bonding XPS rigid foam to EPM/EPDM

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

XPS (rigid foam)

Extruded polystyrene (rigid foam)

EPM/EPDM

Ethylene propylene (diene) rubber


Preview results

tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

COSMO HD-100.600
Bonding Technology

MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.

WELDYX POLYPLAST 3 BEIGE
Bonding Technology

Shock-resistant, structural, solvent-free specialist adhesive designed for bonding low-energy plastics and difficult surfaces to bond.

WELDYX PROFESSIONAL 5 BLACK
Bonding Technology

High-performance adhesive developed especially for structural bonding of metals, composites and plastics.

RAKU® PUR 49-3000
Bonding Technology

RAKU® PUR 49-3000 A with RAKU® PUR 49-2030 B is a solvent-free, two-component reaction adhesive that cures at room temperature. The cured adhesive is weather-resistant and is characterized by a high resistance to media and chemicals.

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