Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

XPS (rigid foam)

Extruded polystyrene (rigid foam)

chromium

Chromium


Preview results

tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

COSMO HD-100.600
Bonding Technology

MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.

Merbenit HM21
Bonding Technology

Merbenit HM21 is an elastic adhesive with excellent sealing properties. Thanks to SMP base universally applicable and highly durable.

COSMO PU-160.110
Bonding Technology

COSMO PU-160.110, constructional adhesive with hard and tough glued joint, is used in the wood processing, in the dry construction for the bonding of overlapping edges of floor pavement elements or as surface adhesive for a lot of industrial applications.

MD MK 3000
Bonding Technology

Bonds immediately, is the new generation of the mounting adhesive, is not shrinking, is very well suited for natural stones, hardens quickly.

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