Bonding BMC to BMC

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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BMC

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Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

MD Megabond 2000
Adhesive Bonding Technology

Bonds metal, stone, woods, plastics and ceramics. Extremely high strength, weatherproof, easy to use.

COSMO PU-160.110
Adhesive Bonding Technology

COSMO PU-160.110, constructional adhesive with hard and tough glued joint, is used in the wood processing, in the dry construction for the bonding of overlapping edges of floor pavement elements or as surface adhesive for a lot of industrial applications.

Polytec TC 411 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

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