Bonding BMC to CR

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

BMC

Bulk molding compounds

CR

Polychloroprene


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

Bylamet RB-35
Adhesive Bonding Technology

Medium viscosity black rubber toughened cyanoacrylate adhesive. It gives fast cures on the majority of industrial substrates and is particularly suitable for bonding rubbers, metals and plastics.

Bylamet EL-35
Adhesive Bonding Technology

Bylamet EL-35 shows better properties of impact resistance, peeling resistance, water resistance and heat resistance than regular Bylamet types.

Bylamet MQ
Adhesive Bonding Technology

Specially for bonding different kinds of wood and leather, 100 ~ 2000 mPas.

Bylamet SVQ
Adhesive Bonding Technology

Fastest setting type, bonding of balsa too, in a few seconds, 3 mPas.

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