Bonding FR4 to CR

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

FR4

Epoxy resin / fiberglass fabric

CR

Polychloroprene


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

Kisling 5880
Adhesive Bonding Technology

Black cyanoacrylate adhesive, which has been developed for all applications under thermal and/ or climatic conditions.

Bylamet RB-35
Adhesive Bonding Technology

Medium viscosity black rubber toughened cyanoacrylate adhesive. It gives fast cures on the majority of industrial substrates and is particularly suitable for bonding rubbers, metals and plastics.

Bylamet EL-35
Adhesive Bonding Technology

Bylamet EL-35 shows better properties of impact resistance, peeling resistance, water resistance and heat resistance than regular Bylamet types.

Bylamet MQ
Adhesive Bonding Technology

Specially for bonding different kinds of wood and leather, 100 ~ 2000 mPas.

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